Case Study: Small Form Factor 8 Layer HDI + Flex PCB Board Design
An innovative hardware solution for our client, which includes a Small Form Factor 8 Layer HDI + Flex PCB board for earbuds and a 2-layer PCB for the charger.
Key Highlights
Power-efficient circuitry for tiny earbuds
Low-power components and optimized layout
Densely packed 8-layer PCB Design
Flexible PCB design
Efficient space utilization
| Engibrains’ Contribution
Segments We Worked On
Hardware
- PCB layer : 8 layer
- PCB Size: 24mm X 4.5mm
- 100+ Electronic Components
- Schematic Design (Altium)
- PCB Layout design (Altium)
- HW Architecture and component selection
- Proto development
- Enclosure design integration
Production
- Prototype Production batch
- Manufacturing test & Diagnostics
- Post delivery support
| Technologies Used
Our Tech Stack will reduce your risk
HW Tools
- Schematic Design (Altium)
- PCB Layout design (Altium)
Peripherals
- Mic(2)
- Speaker
- HALL Sensor
- Touch panel
- Fast Battery charging circuit
- USB 2.0
- EEPROM
- Button
- LEDs
Connectivity
- Bluetooth 5.1
QA Tools
- Digital Oscilloscope
- High-end DMM
- Hot Air Rework Station
- Thermal Camera
- Digital Microscope