Case Study: High-Speed, Small Form Factor Board Design for 18 MP Camera

We designed a compact yet powerful hardware solution that could seamlessly connect an ARM® Cortex®-M4F microcontroller to the high-resolution 18 MP camera. The project, was implemented with a 6-layer stack-up, ensuring that signal integrity and noise considerations were meticulously addressed.

Micro object Detection Using 18 Mega Pixel Camera Sensor 500x500 1

Key Highlights


8 Layer High Speed Design


Optimized component placement and routing


Integration of over 250+ electronic components


Signal integrity and noise considerations


Start from proto to mass production owned by Engibrains

| Engibrains’ Contribution

Segments We Worked On


  • PCB layer : 8 layer
  • PCB Size: 40mm X 40mm
  • 250+ Electronic Components
  • Schematic Design (Altium)
  • PCB Layout design (Altium)
  • Proto to non-form factor unit
  • Production – form factor unit
  • BOM Optimization


  • Prototype- Non-Form Factor
  • Prototype-Form Factor
  • Field Trial Batch #1 – 100 Units
  • Field Trail Batch#2 – 200 Units
  • Post delivery support
  • Production Unit QA

| Technologies Used

Our Tech Stack will reduce your risk

HW Tools

  • Schematic Design (Altium)
  • PCB Layout design (Altium)


  • USB 3.0
  • Mipi
  • CAN
  • I2C
  • SPI

QA Tools

  • Digital Oscilloscope
  • High-end DMM
  • Hot Air Rework Station
  • Thermal Camera
  • Digital Microscope

| Let’s Talk About Your Project

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