Case Study: High-Speed, Small Form Factor Board Design for 18 MP Camera
We designed a compact yet powerful hardware solution that could seamlessly connect an ARM® Cortex®-M4F microcontroller to the high-resolution 18 MP camera. The project, was implemented with a 6-layer stack-up, ensuring that signal integrity and noise considerations were meticulously addressed.
Key Highlights
8 Layer High Speed Design
Optimized component placement and routing
Integration of over 250+ electronic components
Signal integrity and noise considerations
Start from proto to mass production owned by Engibrains
| Engibrains’ Contribution
Segments We Worked On
Hardware
- PCB layer : 8 layer
- PCB Size: 40mm X 40mm
- 250+ Electronic Components
- Schematic Design (Altium)
- PCB Layout design (Altium)
- Proto to non-form factor unit
- Production – form factor unit
- BOM Optimization
Production
- Prototype- Non-Form Factor
- Prototype-Form Factor
- Field Trial Batch #1 – 100 Units
- Field Trail Batch#2 – 200 Units
- Post delivery support
- Production Unit QA
| Technologies Used
Our Tech Stack will reduce your risk
HW Tools
- Schematic Design (Altium)
- PCB Layout design (Altium)
IF/Connectivity
- USB 3.0
- Mipi
- CAN
- I2C
- SPI
QA Tools
- Digital Oscilloscope
- High-end DMM
- Hot Air Rework Station
- Thermal Camera
- Digital Microscope