Case Study: EarBuds(TWS) Development: ANC+CVC Enabled Bluetooth 5.1
A well-known audio equipment manufacturer approached Engibrain to develop a high-quality wireless earbud product that can deliver superior sound quality, excellent battery life, and advanced features such as active noise cancellation (ANC) and clear voice capture (CVC).
Key Highlights
Qualcomm QCC30XX based product
8 layer PCB with HDI + Flex PCB
Best in class Low Power Product
Voice Assistance(Google/Alexa) Enabled
Over the air firmware upgrade
| Engibrains’ Contribution
Segments We Worked On
Hardware
- PCB layer : 8 layer
- PCB Size: 24mm X 4.5mm
- 100+ Electronic Components
- Schematic Design (Altium)
- PCB Layout design (Altium)
- HW Architecture and component selection
- Proto development
- Enclosure design integration
Firmware
- Complete firmware development of charger and buds both (excluding DSP programing).
- Over the air firmware upgrade
- Power optimization: Buds 4 hours + Charging case 12 hours
QA
- 100+ Test Cases Identified
- Interoperability testing with multiple devices
- Automated Test-suite development
- Functional & Regression testing
Production
- Prototype Production batch
- Manufacturing test & Diagnostics
- Post delivery support
| Technologies Used
Our Tech Stack will reduce your risk
HW Tools
- Schematic Design (Altium)
- PCB Layout design (Altium)
Language & Tool
- C
- RTOS
- Python
- Pycharm
- Git
- Atlassian Jira
IF/Connectivity
- Bluetooth 5.1
- USB
- EEPROM
- Button
- Mic & Speaker
- LEDs
QA Tools
- Digital Oscilloscope
- High-end DMM
- Hot Air Rework Station
- Thermal Camera
- Digital Microscope