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ANC+CVC Enabled Bluetooth 5.1 Buds(TWS)


Multimedia, Consumer electronics



Qualcomm QCC30XX family


PCB layer :

8 layer with HDI + Flex PCB[Buds], 2 layer [Charger]


PCB Size:

24mm X 4.5mm[Buds], 30 mm X 40mm [Charger]


Electronic Components:

100+ parts [Buds] , 50+ Parts [Charger]


Our Offerings:

HW Architecture and component selection
Schematic Design (OrCAD)
PCB Layout design (OrCAD)
Board bring up

Embedded Firmware Development

Embedded Quality Engineering



The client is looking to develop an ANC+CVC-enabled Buds having Bluetooth 5.1 connectivity that supports multiple music modes. Their requirement was to design and develop a Buds that supports voice assistance of Google and Alexa along with multi-function touch control.


Engibrains designed and developed Qualcomm QCC30XX based Buds along with all features anticipated by the customer. Engibrains Firmware team developed complete firmware of a charger and buds both excluding DSP programming from the ground up. In addition to that, Engibrains have also developed Over the air(OTA) firmware upgrade to make it future safe. Our team has played a significant role to optimized the power consumptions to have 20+ hours of battery back up during music streaming.

Engibrains’ Role


Embedded HW Services

 – Schematic design & review

 – Layout design & review

 – Component procurement, PCB Fabrication & Assembly

 – Board Bring-up and validation

 – Integration with Mechanical team

Embedded SW Service

 – Application firmware development

 – Power optimization

 – Diag utilities for board bring-up

 – Integration with the mobile app team

Embedded Quality Services

 – Define the Test plan

 – Identify the test cases

 – Test case execution across multiple test cycle

 – Bluetooth range testing

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